Secondary cracking at grain boundaries in silicon thin films-Reference-Cited by-同舟云学术

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Secondary cracking at grain boundaries in silicon thin films

Published:2007-12 Issue:12 Volume:57 Page:1069-1072
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

Chen Jin,Qiao Yu

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering

Reference20 articles.

1. Fracture Mechanics;Anderson,1994

2. Fracture;Hahn,1959

3. Mechanical Behaviors of Materials;Dowling,1998

4. The propagation of cracks through grain boundaries in polycrystalline 3% silicon-iron

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1. Fracture and Fatigue in Microsystems;Mechanics of Microsystems;2018-02-12

2. Sub-grain induced crack deviation in multi-crystalline silicon;Journal of Applied Physics;2017-06-21

3. On the fracture of multi-crystalline silicon wafer;Journal of Physics D: Applied Physics;2016-11-03

4. Stiffness and fracture analysis of photovoltaic grade silicon plates;International Journal of Solids and Structures;2016-10

5. Fracture strength of micro- and nano-scale silicon components;Applied Physics Reviews;2015-06

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