Effect of trace phosphorous on tensile behavior of accumulative roll bonded oxygen-free copper-Reference-Cited by-同舟云学术

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Effect of trace phosphorous on tensile behavior of accumulative roll bonded oxygen-free copper

Published:2005-01 Issue:1 Volume:52 Page:21-24
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

Jang Y.H.,Kim S.S.,Han S.Z.,Lim C.Y.,Kim C.J.,Goto M.

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering

Reference8 articles.

1. High tensile ductility in a nanostructured metal

2. Equal channel angular extrusion: from macromechanics to structure formation

3. Elastic and tensile behavior of nanocrystalline copper and palladium

4. Substructure strengthening mechanisms

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3. High thermal stability of submicron grained Cu processed by asymmetrical rolling;Materials & Design;2016-09

4. Hard Copper with Good Electrical Conductivity Fabricated by Accumulative Roll-Bonding to Ultrahigh Strains;Metals;2016-05-17

5. Strengthening mechanisms in nanostructured interstitial free steel deformed to high strain;Materials Science and Engineering: A;2015-07

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