Lifetime of solid metals in contact with liquid solders for high-temperature liquid solder assemblies
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
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5. Dissolution of solids in contact with liquid solder
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1. Interfacial reaction, microstructure and hardness between graphene-coated Cu substrate and SAC305 solder doped with minor Ni during isothermal aging;Modern Physics Letters B;2019-02-28
2. Cu-Al-Ni Shape Memory Alloy Composites with Very High Damping Capacity;ICOMAT;2013-10-04
3. Development of reliable low temperature wafer level hermetic bonding using composite seal joint;Microelectronics Reliability;2012-03
4. Microstructural evolution of intermetallic compounds in Sn–3.5Ag–X (X=0, 0.75Ni, 1.0Zn and 1.5In)/Cu solder joints during liquid aging;Journal of Alloys and Compounds;2010-01
5. Wafer-Level Hermetic Bonding Using Sn/In and Cu/Ti/Au Metallization;IEEE Transactions on Components and Packaging Technologies;2009-12
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