Nondestructive evaluation of solids and deposited films by thermal-wave interferometry-Reference-Cited by-同舟云学术

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Nondestructive evaluation of solids and deposited films by thermal-wave interferometry

Published:1993-05 Issue:1-4 Volume:69 Page:65-68
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Oesterschulze E.,Stopka M.,Tochtrop-Mayr M.,Masseli K.,Kassing R.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference7 articles.

1. Photoacoustic, photothermal, and related techniques: a review

2. Thermal-wave imaging for nondestructive evaluation

3. Photoacoustic and Photothermal Phenomena;Sodnik,1988

4. Acoustic, Thermal Wave and Optical Characterization of Materials;Kurzmann,1989

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermography techniques for integrated circuits and semiconductor devices;Sensor Review;2007-09-18

2. Vibration-resistant direct-phase-detecting optical interferometers;Applied Optics;1997-10-01

3. Heat transfer—a review of 1993 literature;International Journal of Heat and Mass Transfer;1996-03

4. Thermal imaging and measurement techniques for electronic materials and devices;Microelectronic Engineering;1996-02

5. Photothermal scanning near-field microscopy;Materials Science and Engineering: B;1994-05

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