Stress in Al, AlSiCu, and AlVPd films on oxidized Si substrates-Reference-Cited by-同舟云学术

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Stress in Al, AlSiCu, and AlVPd films on oxidized Si substrates

Published:1995-10 Issue:1-4 Volume:91 Page:215-219
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Leusink G.J.,Lokker J.P.,van den Homberg M.J.C.,Jongste J.F.,Oosterlaken T.G.M.,Janssen G.C.A.M.,Radelaar S.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference6 articles.

1. Development of Highly Reliable AlSiPd Alloy Interconnection for VLSI;Onuki,1988

2. Deformation mechanisms of Al films on oxidized Si wafers

3. Deformation Mechanisms in Thin Films;Frost,1992

4. Mechanical stress as a function of temperature for aluminum alloy films

5. AlSiV and AlSiVPd films as alternatives for AlSiCu interconnect: microstructure and its impact on reliability

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Sputtering Targets and Thin Films for Integrated Circuits;Sputtering Materials for VLSI and Thin Film Devices;2014

2. Pipe-diffusion ripening of Si precipitates in Al-0.5%Cu-1%Si thin films;Philosophical Magazine;2005-10-21

3. Impact of thermal cycling on the evolution of grain, precipitate and dislocation structure in Al, 0.5% Cu, 1% Si thin films;Microelectronic Engineering;2003-11

4. Plasticity-Related Phenomena in Metallic Films on Substrates;MRS Proceedings;2003

5. Stresses in Al/TiW/Si(100) contacts during thermal cycling;Thin Solid Films;1998-11

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