Investigation of the oxidation behaviour of thin film and bulk copper-Reference-Cited by-同舟云学术

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Investigation of the oxidation behaviour of thin film and bulk copper

Published:1995-10 Issue:1-4 Volume:91 Page:152-156
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

O'Reilly M.,Jiang X.,Beechinor J.T.,Lynch S.,NíDheasuna C.,Patterson J.C.,Crean G.M.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference7 articles.

1. Copper deposition and thermal stability issues in copper-based metallization for ULSI technology

2. Effect of the Type of Substrates on the Ductility and Microstructure of Electroless Copper Deposits

3. CCCI.—The formation of protective oxide films on copper and brass by exposure to air at various temperatures

4. Ellipsometric studies on the oxidation of thin copper films

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