Proposal of finite element analysis method for dielectric breakdown based on Maxwell’s equations
Author:
Publisher
Elsevier BV
Subject
Computer Science Applications,General Physics and Astronomy,Mechanical Engineering,Mechanics of Materials,Computational Mechanics
Reference28 articles.
1. Irradiation effects in plexiglas;Gross;J. Polym. Sci.,1958
2. Self-consistent modeling of electrical tree propagation and pd activity;Noskov;IEEE Trans. Dielectr. Electr. Insul.,2000
3. A deterministic model for branched structures in the electrical breakdown of solid polymeric dielectrics;Dissado;J. Phys. D: Appl. Phys.,2000
4. A deterministic model for the growth of non-conducting electrical tree structures;Dodd;J. Phys. D: Appl. Phys.,2002
5. Dielectric breakdown model for composite materials;Peruani;Phys. Rev. E,2003
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Computational prediction of dielectric breakdown strength of a transformer paper in oil with uncertainty quantification;Materials Research Express;2024-08-01
2. Effect of Cracks on the Dielectric Breakdown of Polymers and Ceramics;2024 IEEE 5th International Conference on Dielectrics (ICD);2024-06-30
3. Loss Effects on Time-Reversal Imaging: Analytical, Numerical, and Experimental Investigations;IEEE Transactions on Microwave Theory and Techniques;2024
4. Electrical tree modelling in dielectric polymers using a phase-field regularized cohesive zone model;Materials & Design;2023-11
5. Simulation-Based Performance Evaluation of Wire-Grid approach for 3D Printed Antennas: Comparative Analysis and Experimental Validation;2023 International Ural Conference on Electrical Power Engineering (UralCon);2023-09-29
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3