An investigation of tool wear in the dam-bar cutting of integrated circuit packages
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics
Reference14 articles.
1. State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment
2. E.J. Rymaszewski, R.R. Tummala, Microelectronics Packaging Handbook, Van-Nostrand Reinhold, New York, 1989.
3. Mechanical Deformation of Leadframe Assemblies in Plastic Packages During Molding
4. An investigation of process parameters in the dam-bar cutting of integrated circuit packages
5. An Analysis of Tool Life Based on Flank-Face Wear—Part 1: Theory
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