Improving the tribological behavior of copper through novel Ti–Cu intermetallic coatings-Reference-Cited by-同舟云学术

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Improving the tribological behavior of copper through novel Ti–Cu intermetallic coatings

Published:2002-09 Issue:5-6 Volume:253 Page:626-639
ISSN:0043-1648
Container-title:Wear
language:en
Short-container-title:Wear

Author:

Bateni M.R,Ashrafizadeh F,Szpunar J.A,Drew R.A.L

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Reference21 articles.

1. Oxidation behaviour of titanium coated copper substrate

2. FORMATION OF Ti–Cu INTERMETALLIC COATINGS ON COPPER SUBSTRATE

3. B.D. Horn, M.R. Badger, in: Proceedings of the Conference on ‘Steelmaking’, Acutus Mold Inc., Pittsburgh, PA, USA, 1996, pp. 191–194.

4. Application of graded ceramic coatings for thermal barriers

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