Cu-contamination of single crystalline silicon wafers with thickness of 100 μm during multi-wire sawing process

Author:

Choi SunhoORCID,Jang BoyunORCID,Kim Joonsoo,Song Heeeun,Han Moonhee

Funder

Ministry of Trade, Industry & Energy, Republic of Korea

Publisher

Elsevier BV

Subject

General Materials Science,Renewable Energy, Sustainability and the Environment

Reference40 articles.

1. Effect of the particle size distribution on the low shear viscosity of high-solid-content latexes;Amaral;J. Polym. Sci. Part A: Polym. Chem.,2004

2. Anspach, O., Hurka, B., Zeh, J., Schulze, F.W., 2009. Influence of abrasive shape and size distribution on the wire sawing process. In: Proceedings of the 24th EUPVSEC.

3. Buchholz, F., Wefringhaus, E., Moron, L., Lukesch, M., Weber, W., 2013. Spectrophotometric monitoring of iron and copper contamination of cleaning baths for solar cell processing. In: Proceedings of 28th European Photovoltaic Solar Energy Conference and Exhibition.

4. Bidiville, A., Wasmer, K., Michler, J., Ballif, C., Van der Meer, M., Nasch, P.M., 2007. Towards the Correlation of Mechanical Properties and Sawing Parameters of Silicon Wafers.

5. Bierwisch, C., Weber, B., Kuebler, R., Moseler, M., Kleer, G., 2008. Contact regimes in the wire sawing process: explicit 3d modeling of peg/sic slurry. In: Proceedings of the 23rd EUPVSEC.

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