Semi-permeable Yoffe-type interfacial crack analysis in MEE composites based on the strip electro-magnetic polarization saturation model
Author:
Funder
National Science Foundation of China
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Computational Mechanics
Reference53 articles.
1. Progress and prospects in thin films;Ramesh;Nat. Mater.,2007
2. Multifunctional magnetoelectric materials for device applications;Ortega;J. Phys.: Condens. Matter,2015
3. Multiferroic materials and magnetoelectric physics: symmetry, entanglement, excitation, and topology;Dong;Adv. Phys.,2015
4. Magnetic coupling in ferromagnetic semiconductor GaMnAs/AlGaMnAs bilayer devices;Cao;Sci. China Phys. Mech. Astron.,2014
5. Electrical control of antiferromagnetic metal up to 15 nm;Zhang;Sci. China Phys. Mech. Astron.,2016
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