1. MIL-Std 217D and Amendments U.S. Department of Defense, Washington, D.C.
2. Aluminum electromigration parameters;Partridge,1985
3. Moisture resistance of polymide multilevel interconnect LSIs;Nishida,1985
4. Electromigration and current density dependence;Schafft,1985
5. Electromigration failure modes in aluminum metallization for semiconductor devices;Black,1969