Low latency multicasting architecture implemented using new network topology
Author:
Publisher
Elsevier BV
Subject
Artificial Intelligence,Computer Networks and Communications,Hardware and Architecture,Software
Reference33 articles.
1. Exploring serial vertical interconnects for 3D ICs;Pasricha,2009
2. T. Xu, P. Liljeberg and H. Tenhunen, Optimal Number and Placement of Through Silicon Vias in 3D Network-on-Chip, in: IEEE 14th International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS), 2011, pp. 105–110.
3. Message routing in 3D networks-on-chip;Rusu,2009
4. A framework for rapid evaluation of heterogeneous 3-D NoC architectures;Sotiriou-Xanthopoulos;Microprocessors Microsyst.,2014
5. Three-dimensional Integrated Circuit Design;Pavlidis,2009
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Routing and Wavelength Assignment for Multiple Multicasts in Optical Network-on-Chip (ONoC);IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-12
2. A two-level network-on-chip architecture with multicast support;Journal of Parallel and Distributed Computing;2023-02
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