Multi-mode soft haptic thimble for haptic augmented reality based application of texture overlaying

Author:

Talhan AishwariORCID,Kumar Sanjeet,Kim Hwangil,Hassan Waseem,Jeon Seokhee

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Human-Computer Interaction

Reference65 articles.

1. Tactile displays: Overview and recent advances;Chouvardas;Displays,2008

2. Haptic augmented reality: Taxonomy and an example of stiffness modulation;Jeon;Presence: Teleoperators Virtual Environ.,2009

3. Haptic augmented reality: Taxonomy, re- search status, and challenges;Jeon;Fundamentals Wearable Comput. Augmented Reality,2015

4. Haptic rendering: introductory con- cepts;Salisbury;IEEE Comput. Graphics Appl.,2004

5. M. Adcock, M. Hutchins, C. Gunn, Augmented reality haptics: Using artoolkit for display of haptic applications, in: 2003 IEEE International Augmented Reality Toolkit Workshop, IEEE, 2003, pp. 1–2.

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