Measurements and modelling of the ‘millimanipulation’ device to study the removal of soft solid layers from solid substrates
Author:
Funder
Coordenação de Aperfeiçoamento de Pessoal de Nível Superior
Publisher
Elsevier BV
Subject
Food Science
Reference45 articles.
1. Matching the nano- to the meso-scale: measuring deposit–surface interactions with atomic force microscopy and micromanipulation;Akhtar;Food Bioprod. Process.,2010
2. Development of a ‘millimanipulation’ device to study the removal of soft solid fouling layers from solid substrates and its application to cooked lard deposits;Ali;Food Bioprod. Process.,2015
3. Trackpy;Allan,2016
4. Evaluating non-stick properties of different surface materials for contact frying;Ashokkumar;J. Food Eng.,2011
5. Comparison of velocity profiles for different flow chamber designs used in studies of microbial adhesion to surfaces;Bakker;Appl. Environ. Microbiol.,2003
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Improving Cleaning Efficiency through the Measurement of Food Fouling Adhesive Strength;ACS Omega;2024-05-13
2. Influence of rheological properties and pull-off forces of native and modified starches on cleaning in plane channel flow;Heat and Mass Transfer;2023-07-07
3. Direct measurement of the cohesive strength of whey protein gel in contact with NaOH by wire cutting experiments;Food and Bioproducts Processing;2022-11
4. Lessons to learn from roadmapping in cleaning and decontamination;Food and Bioproducts Processing;2022-09
5. Comparison of models for predicting cleaning of viscoplastic soil layers by impinging coherent turbulent water jets;Chemical Engineering Science;2022-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3