Current density and temperature distributions near the corner of angled metal line
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Civil and Structural Engineering
Reference5 articles.
1. Electromigration & Electronic Device Degradation;Christou,1994
2. Electromigration in metals
3. PATH-INDEPENDENT INTEGRALS FOR HEAT CONDUCTION ANALYSIS IN ELECTROTHERMAL CRACK PROBLEMS
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