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Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process

  • Published:2001-04 Issue:1-2 Volume:319 Page:233-241
  • ISSN:0925-8388
  • Container-title:Journal of Alloys and Compounds
  • language:en
  • Short-container-title:Journal of Alloys and Compounds

Author:

Abbasi M.,Karimi Taheri A.,Salehi M.T.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference14 articles.

1. W.E. Verkamp, Copper-to-aluminum transition in high direct-current bus systems, IEEE Trans. paper No. PCIC-95-20 (1995) 187–194.

2. M. Braunovic, N. Aleksandrov, Effect of electrical current in bimetallic aluminum-copper joint, IEEE Trans. paper No. CHMT-93-10 (1993) 261–268.

3. Analysis of the behavior of bimetallic joints (Al/Cu);Silveria;J. Microstruct. Sci.,1987

4. Explosive Welding of Metal;Crossland,1982
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