Adhesive debonding inspection with a small EMAT in resonant mode-Reference-Cited by-同舟云学术

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Adhesive debonding inspection with a small EMAT in resonant mode

Published:2018-09 Issue: Volume:98 Page:110-116
ISSN:0963-8695
Container-title:NDT & E International
language:en
Short-container-title:NDT & E International

Author:

Liu Tianhao,Pei Cuixiang,Cheng Xin,Zhou Haiqiang,Xiao Pan,Chen Zhenmao

Funder

National Natural Science Foundation

Postdoctoral Science Foundation Program of China

National Magnetic Confinement Fusion Program of China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Condensed Matter Physics,General Materials Science

Reference14 articles.

1. Ultrasonic testing of adhesive bonds of thin metal sheets;Coglio;NDT&E International,1999

2. A review of defect types and nondestructive testing techniques for composites and bonded joints;Adams;NDT&E International,1988

3. The non-destructive testing of adhesively bonded structure: a review;Guyott;The Journal of Adhesion,1986

4. The ultrasonic pulse echo technique as applied to adhesion testing;Tattersall;J. Phys. D: Applied Physics,1973

5. A novel method of processing pulse echo data in adhesive bond inspection;Segal;Journal of Nondestructive Evaluation,1990

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