Author:
Cerezuela Barreto Mercedes,Roeder Georg,Steinhoff Maximilian,Schellenberger Martin,Bauer Anton
Reference3 articles.
1. TLS-Dicing - an innovative alternative to known technologies: ASMC '09; 10 - 12 May 2009, Berlin, Germany;Zühlke,2009
2. Thermal Laser Separation–A Novel Dicing Technology Fulfilling the Demands of Volume Manufacturing of 4H-SiC Devices;Lewke;Materials Science Forum,2015
3. Lewke D, Koitzsch M, Dohnke K-O, Schellenberger M, Zühlke HU, Rupp R, Pfitzner L, Ryssel H (2014). High quality and high speed cutting of 4H-SiC JFET wafers including PCM structures by using Thermal Laser Separation. MRS Proceedings. 1693. 10.1557/opl.2014.566.
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献