Influence of open voltage and servo voltage during Wire-EDM of silicon carbides
Author:
Publisher
Elsevier BV
Subject
General Medicine
Reference16 articles.
1. A study of the surface grinding of 2D C/SiC composites;Liu;Int J Adv Manuf Technol,2017
2. High-speed wire electricaldischarge machining of insulating zirconia with a novel assisting electrode;Guo;Mater Manuf Process,2014
3. Machinability analysis of multi walled carbon nanotubes filled alumina composites in wire electrical discharge machining process;Singh;J Eur Ceram Soc,2017
4. Machining of low electrical conductivematerials by wire electrical discharge machining (WEDM);Kozak;J Mater Process Technol,2004
5. Surface integrity and material removalmechanism associated with the EDM of Al2O3ceramic composites;Patel;Int J Refract Metal Hard Mater,2009
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