Residual stress change in multistage grinding
Author:
Publisher
Elsevier BV
Subject
General Medicine
Reference16 articles.
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3. Kuschel S, Kolkwitz B, Sölter J, Brinksmeier E, Heinzel C. Experimental and Numerical Analysis of Residual Stress Change Caused by Thermal Loads During Grinding. Procedia CIRP 2016; 51-4.
4. Brinksmeier E, Meyer D, Heinzel C, Lübben T, Sölter J, Langenhorst L, Frerichs F, Kämmler J, Kohls E, Kuschel S. Process Signatures – The Missing Link to Predict Surface Integrity in Machining. Procedia CIRP 2018; 3-10.
5. Brinksmeier E, Klocke F, Lucca DA, Sölter J, Meyer D. Process Signatures – A New Approach to Solve the Inverse Surface Integrity Problem in Machining Processes. Procedia CIRP 2014; 429-34.
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