A comparative study of copper thin films deposited using magnetron sputtering and supercritical fluid deposition techniques-Reference-Cited by-同舟云学术

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A comparative study of copper thin films deposited using magnetron sputtering and supercritical fluid deposition techniques

Published:2017-12 Issue: Volume:643 Page:53-59
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Giroire B.,Ali Ahmad M.,Aubert G.,Teule-Gay L.,Michau D.,Watkins J.J.,Aymonier C.,Poulon-Quintin A.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference48 articles.

1. VLSI on-chip interconnection performance simulations and measurements;Edelstein;IBM J. Res. Dev.,1995

2. Copper as the future interconnection materials;Pai,1989

3. Multilevel interconnections for ULSI and GSI era;Murarka;Mater. Sci. Eng.,1997

4. Corrosion behaviour of nanocrystalline copper foil in sodium hydroxide solution;Yu;Scr. Mater.,2007

5. A comparative study of nanocrystalline Cu film deposited using anodic vacuum arc and dc magnetron sputtering;Mukherjee;Surf. Coat. Technol.,2011

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