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Adhesion mechanism between mold resin and sputtered copper for electromagnetic wave shield packages

  • Published:2022-05 Issue: Volume:750 Page:139188
  • ISSN:0040-6090
  • Container-title:Thin Solid Films
  • language:en
  • Short-container-title:Thin Solid Films

Author:

Homma Soichi,Shima Masaya,Takano Yuusuke,Watanabe Takeshi,Murakami Kazuhiro,Fukuda Masatoshi,Imoto Takashi,Nishikawa Hiroshi

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference30 articles.

1. Electromagnetic interference (EMI) of system-on-package (SOP);Sudo;IEEE Trans. Adv. Packag.,2004

2. Clip-attach EMI shielding on electronic IC package;Gomez;Int. J. Sci. Eng. Sci.,2019

3. Low-temperature sintering bonding using silver nanoparticle paste for electronics packaging;Guo;J. Nanomater.,2015

4. Electromagnetic shielding effectiveness and conductivity of PTFE/Ag/MWCNT conductive fabrics using the screen printing method;Cheng;Sustainability,2020

5. Package-level EMI shielding technology with silver paste for various applications;Joo,2017

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