High-power impulse magnetron sputtering of Ti–Si–C thin films from a Ti3SiC2 compound target-Reference-Cited by-同舟云学术

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High-power impulse magnetron sputtering of Ti–Si–C thin films from a Ti3SiC2 compound target

Published:2006-12 Issue:4 Volume:515 Page:1731-1736
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Alami J.,Eklund P.,Emmerlich J.,Wilhelmsson O.,Jansson U.,Högberg H.,Hultman L.,Helmersson U.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference29 articles.

1. Metal ion deposition from ionized mangetron sputtering discharge

2. Proceedings of the XVIIth International Symposium on Discharges and Electrical Insulation in Vacuum, Berkeley, USA, July 21-26;Bugaev,1996

3. A novel pulsed magnetron sputter technique utilizing very high target power densities

4. Ionized physical vapor deposition (IPVD): A review of technology and applications

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