Fracture characterization of brittle thin-films by membrane testing-Reference-Cited by-同舟云学术

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Fracture characterization of brittle thin-films by membrane testing

Published:2014-08 Issue: Volume:564 Page:314-320
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Trueba M.,Gonzalez D.,Martínez-Esnaola J.M.,Hernandez M.T.,Pantuso D.,Li H.,Ocaña I.,Elizalde M.R.

Funder

Intel Corporation

Universidad de Navarra

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Mechanical properties of thin films;Nix;Metall. Mater. Trans. A,1989

2. The thermomechanical integrity of thin films and multilayers;Evans;Acta Metall. Mater.,1995

3. Cracking and debonding in integrated microstructures;Liu,1998

4. Silicon integrated circuit technology from past to future;Iwai;Microelectron. Reliab.,2002

5. Integration of fluorine-doped silicon oxide in copper pilot line for 0.12-μm technology;Reynard;Microelectron. Eng.,2002

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Understanding the extremely low fracture toughness of freestanding gold thin films by in-situ bulge testing in an AFM;Materials Science and Engineering: A;2017-04

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