Investigation of optical properties of benzocyclobutene wafer bonding layer used for 3D interconnects via infrared spectroscopic ellipsometry-Reference-Cited by-同舟云学术

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Investigation of optical properties of benzocyclobutene wafer bonding layer used for 3D interconnects via infrared spectroscopic ellipsometry

Published:2011-02 Issue:9 Volume:519 Page:2924-2928
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Kamineni Vimal K.,Singh Pratibha,Kong LayWai,Hudnall John,Qureshi Jamal,Taylor Chris,Rudack Andy,Arkalgud Sitaram,Diebold Alain C.

Funder

SEMATECH

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics, San Francisco, U.S.A., April 21-25, 2003;Ramm,2003

2. Polymer Interfaces and Thin Films, Boston, U.S.A., November 26-30, 2001;Kwon,2002

3. Acoustic Microscopy;Briggs,1992

4. Acoustic microscope—scanning version

5. Spectroscopic Ellipsometry - Principles and Applications;Fujiwara,2007

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1. Unraveling metallic contaminants in complex polyimide heterostructures using deep ultraviolet spectroscopic ellipsometry;Applied Physics Letters;2023-09-25

2. High-Density Patterned Array Bonding through Void-Free Divinyl Siloxane Bis-Benzocyclobutene Bonding Process;Polymers;2021-10-21

3. New design of InGaAs guided-mode resonance photodiode for SWIR low dark current imaging;Nanophotonics VI;2016-04-21

4. Guided-mode resonator for thin InGaAs P-i-N short-wave infrared photo-diode;Applied Physics Letters;2016-02

5. Bi-layer metamaterials as fully functional near-perfect infrared absorbers;Applied Physics Letters;2015-07-13

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