Passive and heterogeneous integration towards a Si-based System-in-Package concept-Reference-Cited by-同舟云学术

Passive and heterogeneous integration towards a Si-based System-in-Package concept

Published:2006-05 Issue:1-2 Volume:504 Page:391-396
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Roozeboom F.,Kemmeren A.L.A.M.,Verhoeven J.F.C.,van den Heuvel F.C.,Klootwijk J.,Kretschman H.,Frič T.,van Grunsven E.C.E.,Bardy S.,Bunel C.,Chevrie D.,LeCornec F.,Ledain S.,Murray F.,Philippe P.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference10 articles.

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2. http://www.semiconductors.philips.com/markets/communications/nexperia/system/.

3. European Microwave Week, Amsterdam;Philippe,2004

4. IMAPS Conference, Bruges, Belgium;Chevrie,2005

5. IEEE BCTM Meeting, Santa Barbara (USA);Deixler,2005

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