Development and reliability of non-conductive adhesive flip-chip packages-Reference-Cited by-同舟云学术

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Development and reliability of non-conductive adhesive flip-chip packages

Published:2004-09 Issue: Volume:462-463 Page:446-453
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Teh L.K.,Anto E.,Wong C.C.,Mhaisalkar S.G.,Wong E.H.,Teo P.S.,Chen Z.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference10 articles.

1. Overview of conductive adhesive interconnection technologies for LCDs

2. 52nd Electronic Components and Technology Conference, San Diego, USA, May 28–31, 2002;Yim,2002

3. JEDEC Standards, Arlington, VA, 2001, JESD22-A120.

4. 50th Electronic Components and Technology Conference, Las Vegas, USA, May 21–24, 2000;Wong,2000

Cited by 45 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Fine Silica Filler Addition on the CTE and Void Behavior of Non-conductive Paste for CoB Flip Chip Bonding;Journal of Welding and Joining;2018-08-30

2. The effect of solder wetting on nonconductive adhesive (NCA) trapping in NCA applied flip-chip bonding;Journal of Materials Science: Materials in Electronics;2016-03-07

3. Reliability of an ultra-fine-pitch COF flip-chip package using non-conductive paste;Electronic Materials Letters;2016-01

4. Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate;Journal of Electronic Materials;2015-04-17

5. Advanced interconnection technologies for flexible organic electronic systems;Handbook of Flexible Organic Electronics;2015

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