Formation of PtSn4 and PtSn in the initial reaction between Pt and molten Sn-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Formation of PtSn4 and PtSn in the initial reaction between Pt and molten Sn

Published:2018-08 Issue: Volume:659 Page:64-69
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Liu Ting-Yu,Wang Kuang-Kuo,Huang Hui-Chun,Fang Yuang-Shing,Yeh Cheng-Fong,Hsu Yu-Wei,Gan Dershin,Huang Hsing-Lu

Funder

National Science Council of Taiwan

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. Interfacial reaction and wetting behavior between Pt and molten solder;Yang;J. Electron. Mater.,2009

2. Pt thin-film metallization for FC-bonding using SnPb60/40 solder bump metallurgy;Kuhmann;Mater. Sci. Eng. A,1998

3. Dissolution of Au, Ag, Cu, and Ni in a molten Tin-Lead solder;Bader;Weld. J.,1969

4. Compound growth in platinum/tin-lead solder diffusion couples;Meagher;J. Mater. Sci.,1996

5. Coupling effect in Pt/Sn/Cu sandwich solder joint structures;Wang;Acta Mater.,2007

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP