Future challenges in CMOS process modeling

Author:

Pichler P.,Burenkov A.,Lorenz J.,Kampen C.,Frey L.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference72 articles.

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2. http://www.iisb.fraunhofer.de/en/arb_geb/sugert.htm.

3. http://www.itrs.net.

4. Synopsys, Mountain View, CA, USA, Sentaurus TCAD, release a-2008.09 Edition (2008).

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