Preparation and characterization of copper thin film obtained by metal plasma immersion ion implantation and deposition-Reference-Cited by-同舟云学术

Preparation and characterization of copper thin film obtained by metal plasma immersion ion implantation and deposition

Published:2018-03 Issue: Volume:649 Page:136-141
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

dos Santos Demetrio Jackson,Ito Nathalie Minako,de Oliveira Mara Cristina Lopes,Tavares Lara Basílio,Salvadori Maria Cecilia,Antunes Renato Altobelli^ORCID

Funder

FINEP

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference46 articles.

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4. Experimental and theoretical studies on the corrosion inhibition of copper by two indazole derivatives in 3.0% NaCl solution;Qiang;J. Colloid Interface Sci.,2016

5. Protection of copper corrosion in 0.5 M NaCl solution by modification of 5-mercapto-3-phenyl-1,3,4-thiadiazole-2-thione potassium self-assembled monolayer;Chen;Corros. Sci.,2012

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