Dielectric barrier layers by low-temperature plasma-enhanced atomic layer deposition of silicon dioxide-Reference-Cited by-同舟云学术

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Dielectric barrier layers by low-temperature plasma-enhanced atomic layer deposition of silicon dioxide

Published:2018-03 Issue: Volume:649 Page:24-29
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Barako Michael T.,English Timothy S.,Roy-Panzer Shilpi,Kenny Thomas W.,Goodson Kenneth E.

Funder

United States Department of Defense Air Force Office of Scientific Research

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference30 articles.

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2. General bidirectional thermal characterization via the 3omega technique;Bauer;Rev. Sci. Instrum.,2014

3. 1ω, 2ω, and 3ω methods for measurements of thermal properties;Dames;Rev. Sci. Instrum.,2005

4. A four-probe thermal transport measurement method for nanostructures;Kim;Rev. Sci. Instrum.,2015

5. High resolution resistive thermometry for micro/nanoscale measurements;Sadat;Rev. Sci. Instrum.,2012

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