Ultra-flat and ultra-smooth Cu surfaces produced by abrasive-free chemical–mechanical planarization/polishing using vacuum ultraviolet light-Reference-Cited by-同舟云学术

Ultra-flat and ultra-smooth Cu surfaces produced by abrasive-free chemical–mechanical planarization/polishing using vacuum ultraviolet light

Published:2011-10 Issue:4 Volume:35 Page:669-676
ISSN:0141-6359
Container-title:Precision Engineering
language:en
Short-container-title:Precision Engineering

Author:

Kirino Okiharu,Enomoto Toshiyuki

Publisher

Elsevier BV

Subject

General Engineering

Reference7 articles.

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3. Performance of water-soluble fullerenol as novel functional molecular abrasive grain for polishing nanosurfaces;Takaya;CIRP Annals,2009

4. Abrasive-free polishing for copper damascene interconnection;Kondo;J Electrochem Soc,2000

5. Comparison of dicarboxylic acids as complexing agents for abrasive-free chemical mechanical planarization of copper;Ramakrishnan;Microelectron Eng,2007

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