CMP characteristics of quartz glass substrate by aggregated colloidal ceria slurry-Reference-Cited by-同舟云学术

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CMP characteristics of quartz glass substrate by aggregated colloidal ceria slurry

Published:2019-11 Issue: Volume:60 Page:458-464
ISSN:0141-6359
Container-title:Precision Engineering
language:en
Short-container-title:Precision Engineering

Author:

Wakamatsu Kaito,Kurokawa Syuhei,Toyama Takaaki,Hayashi Terutake

Publisher

Elsevier BV

Subject

General Engineering

Reference6 articles.

1. The theory and design of plate glass polishing machines;Preston;J. Soc. Glass Technol.,1927

2. Chemical-mechanical planarization of semiconductor materials,2004

3. Nano size cerium hydroxide slurry for scratch-free CMP process;Tanaka,2014

4. Effects of Ce3+ on removal rate of ceria slurries in chemical mechanical polishing for SiO2;Doi,2014

5. Chemical processes in glass polishing;Cook;J Non-Cryst Solids,1990

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1. Enhanced chemical mechanical polishing (CMP) performance of porous self-assembled spherical cerium oxide via RE(La/Pr/Nd) doping;Applied Surface Science;2025-01

2. Enhancing dispersion stability and recyclability of ceria slurry with polyacrylic acid for improved glass polishing performance;Journal of Industrial and Engineering Chemistry;2024-10

3. Atomic level surface on aspheric quartz crucible with large sizes induced by developed green chemical mechanical polishing with composite rare earth oxides;Surfaces and Interfaces;2024-09

4. A review on the development of ceria for chemical mechanical polishing;Powder Technology;2024-08

5. Kilogram-Scale Recovery of La/Ce and Regeneration of Rare-Earth Polishing Powder Products from Ceria-Based Polishing Powder Waste;ACS Sustainable Resource Management;2024-07-01

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