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Study on the surface damage mechanism of monocrystalline silicon in micro ball-end milling

  • Published:2019-03 Issue: Volume:56 Page:223-234
  • ISSN:0141-6359
  • Container-title:Precision Engineering
  • language:en
  • Short-container-title:Precision Engineering

Author:

Yang Minghui,Peng Fangyu,Yan Rong,Deng Ben,Zhou Lin,Wang Haowei

Funder

National Natural Science Foundation of China

National Science Foundation for Distinguished Young Scholars of China

Micro and Nano Fabrication and Measurement laboratory

Huazhong University of Science and Technology

Publisher

Elsevier BV

Subject

General Engineering

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Simulation of abrasive polishing process of single crystal silicon based on molecular dynamics;The International Journal of Advanced Manufacturing Technology;2022-07-21

2. Nanometric cutting: Mechanisms, practices and future perspectives;International Journal of Machine Tools and Manufacture;2022-07

3. The surface residual stress of monocrystalline silicon in ultrasonic vibration–assisted diamond wire sawing;The International Journal of Advanced Manufacturing Technology;2022-06-16

4. Micro-milling/micro-EDM combined processing technology for complex microarray cavity fabrication;The International Journal of Advanced Manufacturing Technology;2021-02-01

5. A review on micro-milling: recent advances and future trends;The International Journal of Advanced Manufacturing Technology;2020-12-28
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