Three-dimensional structuring of silicon for sensor applications-Reference-Cited by-同舟云学术

Three-dimensional structuring of silicon for sensor applications

Published:1983-01 Issue: Volume:4 Page:455-463
ISSN:0250-6874
Container-title:Sensors and Actuators
language:en
Short-container-title:Sensors and Actuators

Author:

Seidel H.,Csepregi L.

Publisher

Elsevier BV

Subject

General Engineering

Reference13 articles.

1. Technologie dünngeätzter Siliziumfolien im Hinblick auf monolitisch integrierbare Sensoren;Csepregi;1st Report NT 2506,1980

2. Herstellung von Sensoren in Silizium mit Hilfe von anisotropen Ätzen, NTG Fachberichte;Seidel;Sensoren-Technologie und Anwendung, Bad Nauheim,1982

3. Studies on the anisotropy and selectivity of etchants used for the fabrication of stress-free structures;Seidel;Electrochem. Soc. Spring Meeting,1982

4. Vertical etching of silicon at very high aspect ratios;Kendall;Ann. Rev. Mater. Sci.,1979

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