Is there a remnant Variscan subducted slab in the mantle beneath the Paris basin? Implications for the late Variscan lithospheric delamination process and the Paris basin formation
Author:
Publisher
Elsevier BV
Subject
Earth-Surface Processes,Geophysics
Reference129 articles.
1. Northern phyllite zone–stratigraphy;Anderle,1995
2. Speculations on the nature and cause of mantle heterogeneity;Anderson;Tectonophysics,2006
3. Continental collision and the dynamic and thermal evolution of the Variscan orogenic crustal root—numerical models;Arnold;Journal of Geodynamics,2001
4. The continental lithosphere: reconciling thermal, seismic, and petrologic data;Artemieva;Lithos,2009
5. On the relations between cratonic lithosphere thickness, plate motions, and basal drag;Artemieva;Tectonophysics,2002
Cited by 32 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Characterizing Natural Hydrogen Occurrences in the Paris Basin From Historical Drilling Records;Geochemistry, Geophysics, Geosystems;2024-05
2. High‐Temperature Metamorphism and Syn‐ to Late‐Orogenic Magmatism;The Variscan Belt of Western Europe 2;2023-12-20
3. The Brécy depocenter as part of a new northern Massif Central Carboniferous–Permian Basin (France);Comptes Rendus. Géoscience;2023-12-18
4. A Deformed Wedge‐Top Basin Inverted During the Collapse of the Variscan Belt: The Permo‐Carboniferous Lorraine Basin (NE France);Tectonics;2023-11
5. U–Pb age constraints on the Carboniferous–Permian transition in continental basins of eastern equatorial Pangaea (France): implications for the depositional history and correlations across the late Variscan Belt;Journal of the Geological Society;2023-10-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3