1. Bash, C.E., 2001. Analysis of refrigerated loops for electronics cooling. In: Proceedings of IPACK'01 – The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, Kauai, Hawaii, pp. 811–819.
2. Bash, C.E., Patel, C.D., Beitelmal, A., 2002. Acoustic compression for the thermal management of multi-load electronic system. In: Thermomechanical Phenomena in Electronic Systems – Proceedings of the Intersociety Conference, pp. 395–402.
3. Refrigerant flow boiling heat transfer in parallel microchannels as a function of local vapor quality;Bertsch;International Journal of Heat and Mass Transfer,2008
4. Cabuz, C., Cabuz, E.I., Herb, W.R., Rolfer, T., Zook, D., 1999. Mesoscopic sampler based on 3D arrays of electrostatically actuated diaphragms. In: Proceedings of the 10th International Conference on Solid-State Sensors and Actuators, Transducers'99, Sendai, Japan, pp. 1890–1891.
5. Performance potential and challenges of future refrigeration-based electronics cooling approaches;Cremaschi,2007