Apparatus for electronic component disassembly from printed circuit board assembly in e-wastes

Author:

Park Seungsoo,Kim Seongmin,Han YosepORCID,Park Jaikoo

Funder

Global Excellent Technology Innovation of Korea Institute of Energy Technology Evaluation and Planning (KETEP)

Ministry of Trade, Industry & Energy, Republic of Korea

Publisher

Elsevier BV

Subject

Geochemistry and Petrology,Geotechnical Engineering and Engineering Geology

Reference22 articles.

1. Lead-free solders in microelectronics;Abtew;Mater. Sci. Eng. R. Rep.,2000

2. Thermal degradation and decomposition products of electronic boards containing BFRs;Barontini;Ind. Eng. Chem. Res.,2005

3. Lead-free solder assembly: impact and opportunity, electronic components and technology conference;Bradley;IEEE,2003

4. Examining the technology acceptance for dismantling of waste printed circuit boards in light of recycling and environmental concerns;Duan;J. Environ. Manag.,2011

5. Disassembly of electronic products, electronics and the environment, 1994;Feldmann,1994

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