The effects of some plating variables on the structure of thin nickel electrodeposits-Reference-Cited by-同舟云学术

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The effects of some plating variables on the structure of thin nickel electrodeposits

Published:1980-05 Issue:5 Volume:10 Page:331-342
ISSN:0376-4583
Container-title:Surface Technology
language:en
Short-container-title:Surface Technology

Author:

Raghunathan K.,Weil R.

Publisher

Elsevier BV

Subject

General Engineering

Reference14 articles.

1. Initial Stages of Electromonocrystallization of Nickel on Copper-Film Substrates

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Tuning residual stress in electrodeposited nickel films via pulse current;Surfaces and Interfaces;2023-08

2. Grain Growth, Stress, and Impurities in Electroplated Copper;Journal of Materials Research;2002-03

3. Low cycle fatigue of thin copper foils;Thin Solid Films;1996-09

4. Physical properties and structure of electrodeposited nickel from sulphamate–chloride–ethylene glycol bath;Materials Science and Technology;1995-03

5. Bright nickel electroplating;Nickel and Chromium Plating;1993

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