Electrodeposition of copper in the presence of 2-mercaptoethanol
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference12 articles.
1. The Effect of Thiocompounds on the Structure of Copper Electrodeposits
2. Wirkungen der inhibitoren bei der elektrokristallisation
3. Electrodeposition of copper on a copper single-crystal (100) face and on a copper polycrystalline surface in the presence of sulphaguanidine
4. Electrodeposition of copper on a copper single crystal (111) face in the presence of chloride ions
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1. Damascene Copper Electroplating;Handbook of Semiconductor Manufacturing Technology, Second Edition;2007-07-09
2. Effects of the Relationship between Resistivity and Additive Chemistries in Electrochemically Deposited Copper Films;Japanese Journal of Applied Physics;2002-04-15
3. Electroplating copper in sub-100 nm gaps by additives with low consumption and diffusion ability;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2002
4. Leveling effects of copper electrolytes with hybrid-mode additives;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2002
5. Electrodeposition of copper on a copper single-crystal (111) plane in the presence of thiobarbituric acid;Surface and Coatings Technology;1986-01
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