Electroless copper plating from an iminodiacetate bath-Reference-Cited by-同舟云学术

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Electroless copper plating from an iminodiacetate bath

Published:1976-11 Issue:6 Volume:4 Page:515-520
ISSN:0376-4583
Container-title:Surface Technology
language:en
Short-container-title:Surface Technology

Author:

Ohno Izumi

Publisher

Elsevier BV

Subject

General Engineering

Reference18 articles.

1. Modern Electroplating,1963

2. The Structure of the Complexed Copper Species in Electroless Copper Plating Solutions

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Kinetics and Mechanism of Electroless Silver Deposition on a Polyurethane Substrate at Moderate to High Concentration of Metal Precursor and Reductant;Surface Engineering and Applied Electrochemistry;2023-02

2. Cyanide-Free Displacement Silver Plating Using Highly Concentrated Aqueous Solutions of Metal Chloride Salts;Journal of The Electrochemical Society;2019

3. Kinetics and Mechanism of Electroless Deposition of Silver From an Aqueous Bath;Journal of The Electrochemical Society;2018

4. History–From the Discovery of Electroless Plating to the Present;Amorphous and Nano Alloys Electroless Depositions;2016

5. Progress of electroless amorphous and nanoalloy deposition: a review – Part 1;Transactions of the IMF;2013-11

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