Alloying of copper for use in microelectronic metallization-Reference-Cited by-同舟云学术

Alloying of copper for use in microelectronic metallization

Author:

Lanford W.A.,Ding P.J.,Wang Wei,Hymes S.,Murarka S.P.

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference21 articles.

1. Proc. Workshop on ‘Tungsten and Other Advanced Metals for ULSI Applications 1990’;Murarka,1991

2. Diffusion in Solids: Recent Developments;Huntington,1975

3. Diffusion in Solids: Recent Developments;Peterson,1975

4. Proc. 8th VLSI Multilevel Interconnection Conf.;Uttecht,1991

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