Cracks in functionally graded materials
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modeling and Simulation
Reference15 articles.
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4. The stress distribution and curvature of a general compositionally graded semiconductor layer;Freund;J. Crystal Growth,1993
5. Elastoplastic analysis of thermal cycling: layered materials with compositional gradients;Giannakopoulos;Acta Metall.,1995
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