Author:
Salamon N.J.,Masters Christine B.
Subject
Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modeling and Simulation
Cited by
88 articles.
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1. Investigating the Occurrence of Bifurcation in Large Metalized Wafers using ANSYS Layered Shell Elements;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
2. Models of Bifurcation and Gravity Induced Deflection in Wide Band Gap 4H-SiC Semiconductor Wafers;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
3. Comparison of finite element approaches for Si wafer buckling calculation;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
4. Size-dependent bending of a rectangular polymer film;Soft Matter;2023
5. Programming polymorphable yet stiff truss metamaterials in response to temperature;Applied Materials Today;2022-06