Hydrodynamic analysis of chemical mechanical polishing process

Author:

Park Sang-Shin,Cho Chul-Ho,Ahn Yoomin

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials

Reference8 articles.

1. Chemical–mechanical polishing in semidirect contact mode;Bhushan;J. Electrochem. Soc.,1995

2. Stress distribution in chemical mechanical polishing;Srinivasa-Murthy;Thin Solid Films,1997

3. A bowl feed and double sides polishing for silicon wafer for VLSI;Nakamura;Bull. Japan Soc. of Prec. Eng.,1985

4. Feature-scale fluid-based erosion modeling for chemical–mechanical polishing;Runnels;J. Electrochem. Soc.,1994

5. Tribology analysis of chemical mechanical polishing;Runnels;J. Electrochem. Soc.,1994

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