Author:
Park Sang-Shin,Cho Chul-Ho,Ahn Yoomin
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials
Reference8 articles.
1. Chemical–mechanical polishing in semidirect contact mode;Bhushan;J. Electrochem. Soc.,1995
2. Stress distribution in chemical mechanical polishing;Srinivasa-Murthy;Thin Solid Films,1997
3. A bowl feed and double sides polishing for silicon wafer for VLSI;Nakamura;Bull. Japan Soc. of Prec. Eng.,1985
4. Feature-scale fluid-based erosion modeling for chemical–mechanical polishing;Runnels;J. Electrochem. Soc.,1994
5. Tribology analysis of chemical mechanical polishing;Runnels;J. Electrochem. Soc.,1994
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39 articles.
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