Comorbidity effect on speed of recovery after arthroscopic rotator cuff repair
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Publisher
Elsevier BV
Reference28 articles.
1. The effect of hypercholesterolemia on rotator cuff disease;Abboud;Clin Orthop Relat Res,2010
2. Rat rotator cuff tendon-to-bone healing properties are adversely affected by hypercholesterolemia;Beason;J Shoulder Elbow Surg,2014
3. Diabetes mellitus impairs tendon-bone healing after rotator cuff repair;Bedi;J Shoulder Elbow Surg,2010
4. Smoking predisposes to rotator cuff pathology and shoulder dysfunction: a systematic review;Bishop;Arthroscopy,2015
5. Arthroscopic repair of full-thickness tears of the supraspinatus: does the tendon really heal?;Boileau;J Bone Joint Surg Am,2005
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1. Editorial Commentary: One- and Two-Year Outcomes Are Clinically Similar After Rotator Cuff Repair: What Are We Waiting For?;Arthroscopy: The Journal of Arthroscopic & Related Surgery;2024-01
2. Association of obesity with high retears and complication rates, and low functional scores after rotator cuff repair: a systematic review and meta-analysis;Journal of Shoulder and Elbow Surgery;2023-11
3. The Association between Dietary Habits and Rapid Postoperative Recovery of Rotator Cuff Repair;Nutrients;2023-10-28
4. One- and Two-Year American Shoulder and Elbow Surgeons Scores Do Not Vary Significantly After Arthroscopic Rotator Cuff Repair: A Prospective Multicenter Analysis of 1,567 Patients;Arthroscopy: The Journal of Arthroscopic & Related Surgery;2023-10
5. Preoperative factors affecting the quality of life after arthroscopic rotator cuff repair: a prospective study;JSES International;2023-09
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