Thermal, mechanical and ultrasonic properties of cemented tailings backfill subjected to microwave radiation
Author:
Publisher
Elsevier BV
Subject
General Materials Science,Building and Construction,Civil and Structural Engineering
Reference40 articles.
1. Microstructural evolution of cemented paste backfill: Mercury intrusion porosimetry test results;Ouellet;Cem. Concr. Res.,2007
2. The effect of desliming by sedimentation on paste backfill performance;Kesimal;Miner. Eng.,2003
3. Cyclic Shear Response of Cemented Paste Backfill;Suazo;J. Geotech. Geoenviron. Eng.,2017
4. Geotechnical considerations in mine backfilling in Australia;Sivakugan;J. Cleaner Prod.,2006
5. Evaluation of paste backfill mixtures consisting of sulphide-rich mill tailings and varying cement contents;Kesimal;Cem. Concr. Res.,2004
Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of microwave on coupled rheological and mechanical properties of cemented tailings backfill;Construction and Building Materials;2024-08
2. Analyzing microscopic structure and macroscopic strength behavior of cement-based tail fills incorporating fiber by X-ray CT scanning technique;Construction and Building Materials;2024-08
3. Novel Processing Methods of Low-Clinker Multi-Component Cementitious Materials—A Review;Applied Sciences;2024-01-20
4. Analysis of energy dissipation characteristics and numerical simulation of surrounding rock control for backfill combinations with different ash/sand ratios;Quarterly Journal of Engineering Geology and Hydrogeology;2023-11-10
5. Predicting long-term impact of cementitious mine fill considering sand as a copper-tailings substitution;Powder Technology;2023-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3