Performance evaluation of a hybrid cooling system for electronic chips-Reference-Cited by-同舟云学术

Performance evaluation of a hybrid cooling system for electronic chips

Published:2013-02 Issue: Volume:45 Page:155-162
ISSN:0894-1777
Container-title:Experimental Thermal and Fluid Science
language:en
Short-container-title:Experimental Thermal and Fluid Science

Author:

Jeng Lung-Yue,Teng Tun-Ping

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Aerospace Engineering,Nuclear Energy and Engineering,General Chemical Engineering

Reference35 articles.

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2. P. Phelan, V. Chiriac, T. Lee, Current and future miniature refrigeration cooling technologies for high power microelectronics, in: Proceedings of the Seventeenth SEMI-THERM Symposium, IEEE, 2001, pp. 158–167.

3. K. Grubb, CFD Modeling of a Therma-Base (TM) Heat Sink, in: 8th International FloTHERM User Conference, Thermacore, Inc., Las Vegas, USA, 1999, pp. 13–14.

4. D. Mehl, P. Dussinger, K. Grubb, Therma-base (TM) heat sink for microprocessor cooling, Thermacore, Inc., 2007.

5. Heat transfer enhancement using Al2O3–water nanofluid for an electronic liquid cooling system;Nguyen;Appl. Therm. Eng.,2007

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