Convective performance of CuO/water nanofluid in an electronic heat sink

Author:

Selvakumar P.,Suresh S.

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Aerospace Engineering,Nuclear Energy and Engineering,General Chemical Engineering

Reference29 articles.

1. Advanced Materials for Thermal management of Electronic Packaging;Tong,2011

2. Avram Bar Cohen, Mehmet Arik, Michael Ohad, Direct liquid cooling of high flux micro and nanoelectronic components, in: Proceedings of the IEE, vol. 94, no. 8, August 2006.

3. Liquid Cooling of Electronic Devices by Single-Phase Convection;Incropera,1999

4. Enhancing thermal conductivity of fluids with nanoparticles, developments and applications of non-newtonian flows;Choi,1995

5. Anomalously increased effective thermal conductivities of ethylene glycol based nanofluids containing copper nanoparticles;Eastman;Appl. Phys. Lett.,2001

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